Grinding aluminum hydroxide (chemical formula Al (OH)₃) is a high-purity white powder prepared by airflow crushing and classification technology, with a purity of ≥ 99.5% and an average particle size that can be accurately controlled between 0.5-10 μ m. Its core advantages are reflected in:
Particle size uniformity: Adopting nanoscale grinding technology, the particle size distribution is narrow (D90-D10 ≤ 3 μ m), meeting the strict requirements for powder consistency in high-end fields.
High wear resistance: Mohs hardness level of 3-3.5, achieving efficient cutting during polishing while avoiding substrate damage, suitable for precision materials such as optical glass and sapphire.
Chemical stability: Excellent acid and alkali resistance (stable at pH 3-11), does not react with organic compounds, adapts to multiple substrate systems such as resin and rubber, and expands application scenarios.
Ground Aluminum Hydroxide is used as environmentally-friendly halogen- free flame retardant additives in a wide variety of applications.Ground Aluminum Hydroxide Recommended to be used in plastics composites, conveyer belt, epoxy sealing and other rubber based compounds .as Aluminum Hydroxide factory in china , Shandong Taixing also produce several types Aluminium Hydroxide, including precipitated aluminum hydroxide, Low-viscosity Aluminum Hydroxide , these products can be used as flame retardant in plastic and rubber products . we supply high quality Aluminum Hydroxide with lower price and good service
Physical and Chemical Properties
General Properties
| Items | Unit | ATH-10 | ATH-12 | ATH-17 | ATH-20 |
| Al2O3 | % | ≥64.0 | ≥64.0 | ≥64.0 | ≥64.0 |
| SiO2 | % | ≤0.04 | ≤0.04 | ≤0.04 | ≤0.04 |
| Fe2O3 | % | ≤0.02 | ≤0.02 | ≤0.02 | ≤0.02 |
| Na2O | % | ≤0.4 | ≤0.4 | ≤0.4 | ≤0.4 |
| Loss On Ignition | % | 34.0~35.0 | 34.0~35.0 | 34.0~35.0 | 34.0~35.0 |
| Moisture | % | ≤0.3 | ≤0.3 | ≤0.3 | ≤0.3 |
| Mean Particle Diameter | µm | 8~12 | 12~15 | 15~18 | 18~22 |
| Whiteness | HW-A | ≥95 | ≥95 | ≥95 | ≥95 |
| Whiteness | HW-B | ≥93 | ≥93 | ≥93 | ≥93 |
| Whiteness | GW | ≥90 | ≥90 | ≥90 | ≥90 |
| Whiteness | HW-A | ≥95 | ≥95 | ≥95 | ≥95 |
| pH value | 8.5~11.5 | 8.5~11.5 | 8.5~11.5 | 8.5~11.5 |
Application:Recommended to be used in plastics composites, conveyer belt, epoxy sealing and other rubber based compounds
1. Electronics and Semiconductors
Wafer polishing:
Nano sized ground aluminum hydroxide (D50=0.5 μ m) is used for CMP (chemical mechanical polishing) slurry, which can accurately control the copper/silicon surface removal rate (50-100nm/min), achieve global planarization, and adapt to processes below 14nm.
Electronic packaging materials:
Add 30-50% to epoxy resin to increase the thermal conductivity to 1.5W/(m · K), while reducing the coefficient of thermal expansion (CTE ≤ 10ppm/℃), suitable for 5G chip heat dissipation substrates.
2. Abrasives and ceramics
High end polishing solution:
Replacing cerium oxide in optical glass polishing improves grinding efficiency by 20% and reduces surface defect rate to ≤ 0.1/mm ², suitable for mobile phone cover glass and camera lenses.
Structural ceramics:
As a pore forming agent, adding 5-10% can generate Al ₂ O Ⅲ and release gas through high-temperature decomposition (above 300 ℃), which can regulate the porosity of ceramics (10-30%) and is suitable for filter elements and catalyst carriers.
3. Coatings and composite materials
Wear resistant coating:
Adding 20-30% to polyurethane coating can increase pencil hardness to 6H and wear resistance by 40%. It is suitable for surface protection of aerospace equipment and industrial flooring.
Polymer modification:
Adding 15-20% to nylon PA6 can increase bending strength by 15% and reduce friction coefficient to below 0.2, making it suitable for precision gears and bearing cages.
Packaging:Net weight 25kg/bag, Compound paper-plastic bag
Storage and Attention:Keep in dry, room temperature and moisture proof condition, preventing the heating
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